Lamination materials for PCB ,FPC , such as Release film: usually made of PET material, with high tensile strength and impact strength, used for separation during the lamination process. High temperature adhesive release film: The main components are polyester resin and polyethylene resin, which have good heat resistance and filling properties, and are suitable for lamination of FPC high-precision boards.
In the field of electronic manufacturing, ICT testing and FCT testing are two key testing methods that each undertake different testing tasks and application scenarios. The following is a detailed comparison of these two testing methods ：
ICT (In Circuit Test) is an electronic testing technology used to detect and diagnose components and circuit connections on printed circuit boards (PCBs). ICT testing helps ensure the quality and reliability of products, especially in large-scale production processes. The following will provide a de
Release film is placed between each layer of substrate to ensure that the materials of each layer do not stick together during the pressing process. This helps maintain the separation state of the material, facilitating subsequent processing and handling.
In the manufacturing of FPC, the lamination step is an important process for bonding multiple layers of substrates and circuit patterns together. The release film also played an important role in this process:1. Separate multi-layer materials: Release film is placed between each layer of substrate t
In the manufacturing of FPC, the lamination step is an important process for bonding multiple layers of substrates and circuit patterns together. The release film also played an important role in this process:1. Separate multi-layer materials: Release film is placed between each layer of substrate t
The third factory is currently under construction, and upon completion, multiple fully automated film product production lines will be added. At that time, the company will have nearly 20 fully automated production lines, greatly increasing production scale, shortening delivery time, and meeting cus
According to a research report by QYR, the global market size of TPX release film for semiconductor flexible circuit boards in 2022 is approximately $803.72 million, with an expected compound annual growth rate (CAGR) of 11.29% over the next six years, reaching $1658.21 million by 2029.
A new production workshop for cutting tools is under construction, and we will increase production lines to expand the production of cutting tools and meet the increasing product demands of our customers.
