Release film for rigid-flex and flexible circuit applications

Prevent material adhesion: Release film is placed between each layer of substrate to ensure that the materials of each layer do not stick together during the pressing process. This helps maintain the separation state of the material, facilitating subsequent processing and handling.

Improving the quality of lamination: The flatness and smooth surface of the release film can improve the surface quality of the printed circuit board (such as FPC) after lamination and reduce defects. This helps maintain the structural integrity and electrical performance of the circuit board.

Pollution prevention: Release film can protect the substrate and circuit pattern, preventing contamination or damage during the lamination process. This is crucial for maintaining the quality and reliability of the circuit board.

Control board surface expansion and contraction: The release film locks around the compression parts to reduce deformation caused by heat and pressure. It has a significant effect in the Z-axis direction and minimal deformation in the X-Y axis direction, effectively solving the problem of board surface expansion and contraction in circuit boards.

Adhesive blocking ability: Release film can to some extent prevent acrylic or epoxy resin adhesive from flowing into drilled or punched holes, and can also play a certain blocking role at the surface joints of soft and hard bonding plates, possessing certain adhesive blocking properties.

Through these effects, the release film significantly improves the lamination quality and production efficiency of the circuit board, while also enhancing the quality and reliability of the final product.

Release film plays the following key roles in the lamination process of circuit boards:

Prevent material adhesion: Release film is placed between each layer of substrate to ensure that the materials of each layer do not stick together during the pressing process. This helps maintain the separation state of the material, facilitating subsequent processing and handling.

Improving the quality of lamination: The flatness and smooth surface of the release film can improve the surface quality of the printed circuit board (such as FPC) after lamination and reduce defects. This helps maintain the structural integrity and electrical performance of the circuit board.

Pollution prevention: Release film can protect the substrate and circuit pattern, preventing contamination or damage during the lamination process. This is crucial for maintaining the quality and reliability of the circuit board.

Control board surface expansion and contraction: The release film locks around the compression parts to reduce deformation caused by heat and pressure. It has a significant effect in the Z-axis direction and minimal deformation in the X-Y axis direction, effectively solving the problem of board surface expansion and contraction in circuit boards.

Adhesive blocking ability: Release film can to some extent prevent acrylic or epoxy resin adhesive from flowing into drilled or punched holes, and can also play a certain blocking role at the surface joints of soft and hard bonding plates, possessing certain adhesive blocking properties.

Through these effects, the release film significantly improves the lamination quality and production efficiency of the circuit board, while also enhancing the quality and reliability of the final product.