The key role of release film in the compression step

In the manufacturing of FPC, the lamination step is an important process for bonding multiple layers of substrates and circuit patterns together. The release film also played an important role in this process:

1. Separate multi-layer materials: Release film is placed between each layer of substrate to ensure that the materials of each layer do not stick together during the compression process.

2. Improving the quality of lamination: The flatness and smooth surface of the release film can improve the surface quality of the FPC after lamination and reduce defects.

3. Pollution prevention: Release film can protect the substrate and circuit pattern, preventing contamination or damage during the lamination process。

For example, in the lamination process of multi-layer FPC, a release film is placed between each substrate layer, and the substrate layers and circuit patterns are bonded together through hot pressing and high voltage. After compression, the release film can be easily peeled off, ensuring smooth separation of each layer of material.