1. Filling and buffering function: The middle layer of the three in one buffer film has excellent buffering and filling performance, which can effectively fill the gaps between the layers of the circuit board, reduce the gaps and bubbles caused by high-pressure compression, and ensure the structural integrity of the circuit board.
2. Adhesive blocking and overflow prevention: The middle layer of the buffer film usually contains composite adhesive blocking materials, which help prevent the flow of adhesive during the pressing process, reduce the problems of side overflow and leakage, and improve the manufacturing yield of circuit boards.
3. High temperature resistance: The three in one buffer film can withstand high temperature compression conditions, ensuring stable performance even in high temperature environments, without deformation or loss of buffering effect, thereby ensuring the quality and stability of the circuit board.
4. Good release effect: The upper and lower layers use high-temperature release films to ensure a clean and pollution-free release process, which meets environmental protection requirements.
5. Improve production efficiency: Using a three in one buffer film can simplify the pressing process because it can reduce pressing time and improve pressing efficiency.
